[8p-PA2-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [8p-PA2-15] A Tilt Sensor Using a High-Resolution MEMS Inertial Sensor Fabricated by Multi-Layer Metal Technology

〇Ippei Tsuji^1,3, Motohiro Takayasu^1,3, Hiroyuki Ito^1,3, Daisuke Yamane^1,3, Shiro Dosho^1,3, Toshifumi Konishi^1,2,3, Noboru Ishihara^1,3, Katsuyuki Machida^1,3, Kazuya Masu^1,3 (1.Tokyo Tech., 2.NTT-AT, 3.JST-CREST)

Keywords:Multi-Layer Metal Technology, MEMS Inertial Sensor, Tilt Sensor