The 78th JSAP Autumn Meeting, 2017

Sessions

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Oral presentation

[6a-C21-1~12] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Sep 6, 2017 9:15 AM - 12:15 PM C21 (C21)

Kazuyoshi Ueno(Shibaura Inst. of Tech), Masahide Goto(NHK)

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Oral presentation

[6p-C21-1~20] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Sep 6, 2017 1:45 PM - 7:00 PM C21 (C21)

Kuniyuki Kakushima(Titech), Masato Sone(Titech)

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Oral presentation

[7a-C21-1~13] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Thu. Sep 7, 2017 9:00 AM - 12:30 PM C21 (C21)

Takashi Noguchi(Univ. of the Ryukyus), Taizoh Sadoh(Kyushu Univ.)

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Oral presentation

[8a-C21-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Sep 8, 2017 9:15 AM - 12:00 PM C21 (C21)

Reo Kometani(Univ. of Tokyo)

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Poster presentation

[8p-PA2-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Sep 8, 2017 1:30 PM - 3:30 PM PA2 (P)

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