[6a-C21-1~12] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6a-C21-7] Formation of copper film by high-pressure hydrogen plasma enhanced transport

〇Hiromasa Ohmi¹, Tatuya Hirono¹, Yusuke Kubota², Yoshiki Sirasu¹, Hiroaki Kakiuchi¹, Kiyoshi Yasutake¹ (1.Osaka Univ., 2.Tokyo Electron LTD.)

Keywords:copper, wiring, hydrogen plasma

高圧水素プラズマを用いた銅の輸送成膜について、得られた銅膜の特性等を報告する。