The 78th JSAP Autumn Meeting, 2017

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[8p-PA2-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Sep 8, 2017 1:30 PM - 3:30 PM PA2 (P)

1:30 PM - 3:30 PM

[8p-PA2-4] Alleviation of Extrinsic State and S-factor for Ge Contact by Amorphous Interlayer and N atom

Wataru Itaya1, Kohei Nakae1, Keisuke Yamamoto1, Dong Wang1, Hiroshi Nakashima2 (1.Interdisciplinary Graduate School of Engineering Sciences, Kyushu Univ., 2.GIC, Kyushu Univ.)

Keywords:semiconductor