Norio Umeyama

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Speaker, Author, Co-Author

Wed. Sep 6, 2017 1:45 PM - 7:00 PM C21 (C21)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6p-C21-1~20] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

5:30 PM - 5:45 PM

[6p-C21-15] Characterization of CMP Planarization Process in Minimal Fab

〇Norio Umeyama^1,2, Noriko Miura², Fumito Imura^1,2, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL)

6:00 PM - 6:15 PM

[6p-C21-17] Half-inch Wafers for New Materials Processing Model

〇Norio Umeyama^1,2, Takaaki Sakai³, Atsushi Kajikura³, Kouichiro Ichikawa³, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL, 3.Fujikoshi Machinery)

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