Koichi Kido

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Speaker, Author, Co-Author

Wed. Sep 6, 2017 9:15 AM - 12:15 PM C21 (C21)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6a-C21-1~12] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

11:15 AM - 11:30 AM

[6a-C21-9] Barrier property between Cu and SiO₂ by adding Zn for LSI wiring

〇(M2)Koichi Kido¹, Daisuke Ando¹, Yuji Suto¹, Junichi Koike¹ (1.Tohoku Univ.)