Akira Ishibashi

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Speaker, Author, Co-Author

Wed. Sep 6, 2017 1:45 PM - 7:00 PM C21 (C21)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6p-C21-1~20] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

6:45 PM - 7:00 PM

[6p-C21-20] Synergy between Minimal Fab. System and Clean Unit System Platform (CUSP)

〇Akira Ishibashi^1,5,6, Junji Matsuda², Nobutoshi Noguchi³, Tsukio Etoh⁴, Yoshihisa Ohashi⁵, Shiro Hara⁶ (1.RIES, Hokkaido Univ., 2.Hiei Kensetsu, 3.Ishibashi Arch. Assc, 4.Kindai Setsubi Skkei, 5.CsTEC Corp., 6.AIST)

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