The 78th JSAP Autumn Meeting, 2017

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13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[8p-PA2-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Sep 8, 2017 1:30 PM - 3:30 PM PA2 (P)

1:30 PM - 3:30 PM

[8p-PA2-10] Convenient Evaluation of Fracture Strength of Metal Film by Using Multilayer Bulge Method

〇Norio Ishitsuka1, Noriyuki Sakuma1 (1.HItachi R&D Group)

Keywords:MEMS, Fracture Strength, Aluminum