Fumito Imura

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Speaker, Author, Co-Author

Wed. Sep 6, 2017 1:45 PM - 7:00 PM C21 (C21)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6p-C21-1~20] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

6:15 PM - 6:30 PM

[6p-C21-18] Laser-Via Process of Half-Inch Sized Package Fabricated by Minimal Fab

〇Fumito Imura^1,2, Michihiro Inoue¹, Arami Saruwatari¹, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL)