Tatsuki Hieda

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Speaker, Author, Co-Author

Thu. Sep 7, 2017 9:00 AM - 12:30 PM C21 (C21)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[7a-C21-1~13] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

11:15 AM - 11:30 AM

[7a-C21-9] Analyses on Residual Thermal Stress in Thermal-Plasma-Jet Crystallized Amorphous Silicon Films on Flexible Glass Substrate

〇Tatsuki Hieda¹, Hiroaki Hanafusa¹, Seiichiro Higashi¹ (1.Hiroshima Univ.)