The 78th JSAP Autumn Meeting, 2017

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[7a-C21-1~13] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Thu. Sep 7, 2017 9:00 AM - 12:30 PM C21 (C21)

Takashi Noguchi(Univ. of the Ryukyus), Taizoh Sadoh(Kyushu Univ.)

11:15 AM - 11:30 AM

[7a-C21-9] Analyses on Residual Thermal Stress in Thermal-Plasma-Jet Crystallized Amorphous Silicon Films on Flexible Glass Substrate

Tatsuki Hieda1, Hiroaki Hanafusa1, Seiichiro Higashi1 (1.Hiroshima Univ.)

Keywords:Thermal-Plasma-Jet, Flexible Glass