Yongxun Liu

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Speaker, Author, Co-Author

Wed. Sep 6, 2017 1:45 PM - 7:00 PM C21 (C21)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6p-C21-1~20] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

5:15 PM - 5:30 PM

[6p-C21-14] Fabrication of Micro-SOI-Diaphragm Structures Using Minimal Deep-RIE and Mask Aligner

〇Yongxun Liu¹, Hiroyuki Tanaka¹, Norio Umeyama¹, Sommawan Khumpuang¹, Masayoshi Nagao¹, Takashi Matsukawa¹, Shiro Hara¹ (1.AIST)