Kengo Igawa

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Speaker, Author, Co-Author

Tue. Mar 14, 2017 1:30 PM - 3:30 PM P3 (BP)

Poster presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

1:30 PM - 3:30 PM

[14p-P3-10] Mechanical Property Evaluation of NiFeCoGa Shape Memory Alloys Using Micro-compression Specimens

〇Kengo Igawa¹, Sari Yanagida¹, Tso-Fu Mark Chang¹, Chun-Yi Chen¹, Masaki Tahara¹, Tomonari Inamura¹, Hideki Hosoda¹, Volodymyr A. Chernenko², Masato Sone¹ (1.Tokyo Tech., 2.Ikerbasque)

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