Motohiro Takayasu

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Speaker, Author, Co-Author

Tue. Mar 14, 2017 1:30 PM - 3:30 PM P3 (BP)

Poster presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

1:30 PM - 3:30 PM

△ [14p-P3-18] A Study of Module using MEMS Accelerometer by Multi-layer Metal Technology

〇(D)Motohiro Takayasu^1,3, Toshiaki Gonda^1,3, Daisuke Yamane^1,3, Hiroyuki Ito^1,3, Toshifumi Konishi², Shiro Dosho^1,3, Noboru Ishihara^1,3, Katsuyuki Machida^1,2,3, Kazuya Masu^1,3 (1.Tokyo Tech., 2.NTT-AT, 3.JST-CREST)

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