Masanori Iwata

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Speaker, Author, Co-Author

Thu. Mar 16, 2017 9:00 AM - 12:15 PM E206 (E206)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[16a-E206-1~13] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

11:45 AM - 12:00 PM

[16a-E206-12] Fan-Out type RDL package fabrication using hybrid process of minimal package process and conventional metal PVD

〇Masanori Iwata¹, Toru Mannami¹, Nobuyoshi Yamauchi¹, Kenji Miyake¹, Fumito Imura², Sommawan Khumpuang², Shiro Hara² (1.PMT, 2.AIST)