Hiroyuki Tanaka

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Speaker, Author, Co-Author

Thu. Mar 16, 2017 9:00 AM - 12:15 PM E206 (E206)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[16a-E206-1~13] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

10:30 AM - 10:45 AM

[16a-E206-7] Through silicon via etching with high-speed gas-switching Bosch process using minimal ICP deep trench etcher (II)

〇Hiroyuki Tanaka^1,2, Hisato Ogiso^1,2, Shizuka Nakano^1,2, Yoshiyuki Nozawa^2,3, Toshihiro Hayami^2,3, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL, 3.SPPT)

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