Hiroki Yoshikawa

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Speaker, Author, Co-Author

Fri. Mar 17, 2017 1:45 PM - 3:30 PM E206 (E206)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-E206-1~7] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

2:15 PM - 2:30 PM

△ [17p-E206-3] Properties of self-reductive Cu submicron particle paste

〇(M2)Hiroki Yoshikawa¹, Shijo Nagao², Takahiko Sakaue³, Yoichi Kamikoriyama³, Takahumi Sasaki⁴, Noriko Kagami², Tohru Sugahara², Jinting Jiu², Katsuaki Suganuma² (1.Osaka Univ., 2.Osaka Univ. ISIR, 3.Mitsui Mining & Smelting, 4.Hikoshima Smelting)

2:30 PM - 2:45 PM

[17p-E206-4] Reliability study on sintered Cu paste structure developed for thermostable die-attach

〇(M2)Hiroki Yoshikawa¹, Shijo Nagao², Takahiko Sakaue³, Yoichi Kamikoriyama³, Takahumi Sasaki⁴, Akio Shimoyama², Tohru Sugahara², Jinting Jiu², Katsuaki Suganuma² (1.Osaka Univ., 2.Osaka Univ. ISIR, 3.Mitsui Mining & Smelting, 4.Hikoshima Smelting)

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