Katsuya Furuna

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Speaker, Author, Co-Author

Fri. Mar 17, 2017 1:45 PM - 3:30 PM E206 (E206)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-E206-1~7] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

2:45 PM - 3:00 PM

[17p-E206-5] Impacts of annealing on interfaces of Al foil / Si junctions by using surface activated bonding

〇Katsuya Furuna¹, Jianbo Liang¹, Moeko Matsubara², Marwan Dhamrin², Yoshitaka Nishio², Naoteru Shigekawa¹ (1.Osaka City Univ., 2.Toyo Aluminium K.K.)