Yusuke Omata

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Speaker, Author, Co-Author

Fri. Mar 17, 2017 1:45 PM - 3:30 PM E206 (E206)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-E206-1~7] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

3:15 PM - 3:30 PM

[17p-E206-7] Material Structure of Silicon-Carbon Alloy Fabricated by C Hot Ion Implantation Technique(Ⅰ)

〇Yusuke Omata¹, Takashi Aoki¹, Toshiyuki Sameshima², Tomohisa Mizuno¹ (1.Kanagawa Univ., 2.Tokyo Univ Agri. Tech.)