The 64th JSAP Spring Meeting, 2017

Presentation information

Oral presentation

3 Optics and Photonics » 3.7 Laser processing

[14a-512-1~11] 3.7 Laser processing

Tue. Mar 14, 2017 9:00 AM - 12:15 PM 512 (512)

Takahiro Nakamura(Tohoku Univ.), Yuji Sato(Osaka Univ.)

9:00 AM - 9:15 AM

[14a-512-1] Fabrication of various engineering plastic films with through-holes using picosecond pulsed laser for Print and Imprint method

Kento Seki1, 〇Takahiro Nakamura1, Kazuro Nagase2, Masaru Nakagawa1 (1.IMRAM, Tohoku Univ., 2.Mino Group Co.)

Keywords:laser drilling, thin film, polymer

To level residual layer thicknesses (RLTs) of micro/nano resist patterns, we propose a ‘Print and Imprint’ method for high-viscosity UV-curable resins, which comprises screen printing and UV nanoimprinting. In this study, we investigated the fabrication of through-hole membrane masks for screen printing by laser drilling of engineering plastic films of polyimide (PI), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), and polyether ether ketone (PEEK) using a picosecond pulsed laser. Exposure of laser pulses to the films under a pulse energy of 1.2 microJ and repetition rate of 10 kHz successfully formed through-holes. The films with lower transmittance at a laser wavelength of 532 nm tended to have larger mean diameters on the backside film surface. We selected PI films among the engineering plastic films for screen printing masks in terms of through-hole morphology (circularity, flatness, uniformity) and chemical and thermal stabilities.