The 64th JSAP Spring Meeting, 2017

Presentation information

Oral presentation

13 Semiconductors » 13.8 Compound and power electron devices and process technology

[14p-315-1~15] 13.8 Compound and power electron devices and process technology

Tue. Mar 14, 2017 1:15 PM - 5:15 PM 315 (315)

Kenji Shiojima(Univ. of Fukui), Kozo Makiyama(Fujitsu Lab.)

2:45 PM - 3:00 PM

[14p-315-7] Wafer-level nondestructive inspection regarding the substrate off-angle and the yellow luminescence of n--drift layer in vertical GaN-on-GaN Schottky diodes

FUMIMASA HORIKIRI1, YOSHINOBU NARITA1, TAKEHIRO YOSHIDA1, TOSHIO KITAMURA1, HIROSHI OHTA2, TOHRU NAKAMURA2, TOMOYOSHI MISHIMA2 (1.Sciocs Co. Ltd., 2.Hosei Univ.)

Keywords:GaN, power device, nondestructive inspection

In this study, we demonstrate the wafer-level nondestructive inspection of GaN Schottky barrier diode epi-structures grown by MOVPE on free-standing GaN substrates, which have various off-angles and deviations. Yellow photoluminescence intensities of the n-drift layer were revealed as functions of the substrate off-angle. The distribution of the net donor concentration indicates that carbon impurity steeply increases in the low off-angle region. We will also report the results of the C-V and SIMS.