The 64th JSAP Spring Meeting, 2017

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Mar 14, 2017 1:30 PM - 3:30 PM P3 (BP)

1:30 PM - 3:30 PM

[14p-P3-13] A SPICE-based Multi-Physics Simulation for Vibrating Energy Harvesting Devices

〇(B)Tomoki Iizuka1, Daisuke Yamane1, Toshifumi Konishi2, Hiroyuki Ito1, Noboru Ishihara1, Katsuyuki Machida1,2, Kazuya Masu1 (1.Tokyo Tech, 2.NTT-AT)

Keywords:MEMS, energy harvesting, multi-physics