[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [14p-P3-13] A SPICE-based Multi-Physics Simulation for Vibrating Energy Harvesting Devices

〇(B)Tomoki Iizuka¹, Daisuke Yamane¹, Toshifumi Konishi², Hiroyuki Ito¹, Noboru Ishihara¹, Katsuyuki Machida^1,2, Kazuya Masu¹ (1.Tokyo Tech, 2.NTT-AT)

Keywords:MEMS, energy harvesting, multi-physics