[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14p-P3-15] Young’s Modulus Evaluation of Electroplated Ti/Au Structures by Multi-layer Metal Technology (2)

〇Hideaki Nakajima^1,2, Tso-Fu Mark Chang^1,2, Chun-Yi Chen^1,2, Toshifumi Konishi³, Katsuyuki Machida^1,2,3, Hiroshi Toshiyoshi^2,4, Daisuke Yamane^1,2, Kazuya Masu^1,2, Masato Sone^1,2 (1.Tokyo Tech, 2.JST-CREST, 3.NTT-AT, 4.Tokyo Univ.)

Keywords:Young's modulus, gold, electroplating