[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14p-P3-17] A Spring Design for Tri-axis MEMS Accelerometer by Multi-layer Metal Technology.

〇TERUAKI SAFU¹, Toshifumi Konishi¹, Daisuke Yamane^2,4, Hiroshi Toshiyoshi^3,4, Masato Sone^2,4, Kazuya Masu^2,4, Katsuyuki Machida^1,2,4 (1.NTT-AT, 2.Tkyo Tech., 3.Univ. of Tokyo, 4.JST-CREST)

Keywords:Microelectromechanical Systems, Accelerometer

We have developed a highly-sensitive MEMS (Microelectromechanical Systems) accelerometer with multi-layer metal technology.The proposed serpentine spring with multi-layer metal structure can suspend a high-density proof mass and provide three-axis suspension functionality. Moreover, the proposed spring structure enhances the design flexibility of the spring constant in each axis. The measurement results of the fabricated device have a good agreement with the designed characteristics.