[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [14p-P3-18] A Study of Module using MEMS Accelerometer by Multi-layer Metal Technology

〇(D)Motohiro Takayasu^1,3, Toshiaki Gonda^1,3, Daisuke Yamane^1,3, Hiroyuki Ito^1,3, Toshifumi Konishi², Shiro Dosho^1,3, Noboru Ishihara^1,3, Katsuyuki Machida^1,2,3, Kazuya Masu^1,3 (1.Tokyo Tech., 2.NTT-AT, 3.JST-CREST)

Keywords:Multi-layer Metal Technology, MEMS, Inertial Sensor