The 64th JSAP Spring Meeting, 2017

Presentation information

Symposium (Oral)

Symposium » Highly reliable metallization technology for long term retention

[15p-304-1~10] Highly reliable metallization technology for long term retention

Wed. Mar 15, 2017 1:15 PM - 6:00 PM 304 (304)

Shinji Yokogawa(UEC), Eiichi Kondoh(U. Yamanashi)

3:30 PM - 4:00 PM

[15p-304-5] Reliability issues and lifetime prediction of LSI interconnects

Shinji Yokogawa1 (1.Univ. Electro.-comm.)

Keywords:semiconductor, interconnects, reliability

In the viewpoint of very long-term reliability, the reliability issues of semiconductor interconnects will be discussed. For the evaluation of wear-out failure such as EM, SIV, TDDB, etc., many researches have already been carried out for many years, and evaluation methods and lifetime prediction methods have been established. However, there are physical limits of the accelerating reliability testing, so statistical issues need to be considered in order to predict and evaluate very long-term reliability over 100 years. In this presentation, some statistical methods to deal with those issues will be discussed.