The 64th JSAP Spring Meeting, 2017

Presentation information

Symposium (Oral)

Symposium » Progress and outlook of nanoimprint technology

[15p-512-1~9] Progress and outlook of nanoimprint technology

Wed. Mar 15, 2017 1:30 PM - 6:00 PM 512 (512)

Atsushi Yokoo(NTT), Hiroshi Hiroshima(AIST)

5:30 PM - 5:45 PM

[15p-512-8] Direct imprinting of liquid silicon

TAKASHI MASUDA1, TATSUYA SHIMODA1 (1.JAIST)

Keywords:imprint, silicon, solution process

Silicon is the most important materials for current industry. In general, silicon devices have been fabricated based on solid-phase silicon (wafer) or gas-phase silicon (silane/disilane). On the other hand, liquid-phase silicon is unexploited. Therefore, we synthesized liquid-phase silicon (Liquid silicon) as a precursor for semiconducting silicon, and directly imprinted it to form well-defined and fine amorphous/crystalline silicon patterns with dimensions of several hundreds of nanometers or less. Direct imprinting of liquid silicon is practical approach to realize solution-processed silicon devices without photolithography process. Moreover, the technique produced well-defined silicon patterns with high resolution and high throughput, demonstrating its potential for next generation silicon devices in a field of nano-structured devices. The elimination of the conventional photolithography process in microfabrication of silicon devices is particularly important for realization of printed silicon electronics.