[16a-E206-1~13] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[16a-E206-4] Minimal CVD Process with Minimum Materials Consumption

〇Hitoshi Habuka¹, Miya Matsuo¹, Ayami Yamada¹, Ning Li¹, Takanori Mikahara^2,3, Shin-ichi Ikeda^2,3, Yuuki Ishida^2,3, Shiro Hara^2,3 (1.Yokohama Nat. Univ., 2.MINIMAL, 3.AIST)

Keywords:Minimal manufacturing, Chemical Vapor Deposition, Epitaxial reactor

Chemical Vapor Deposition (CVD) process and reactor for the Minimal Manufacturing was re-designed in order to achieve the minimal materials consumption. Its major issue is to use the natural convection which is spontaneously produced by the combination of small gas supply and the high temperature. By employing this concept, the gas flow rate can be shrunk from 1000 sccm to less than 50 sccm.