The 64th JSAP Spring Meeting, 2017

Presentation information

Symposium (Oral)

Symposium » Process technology for advanced power semiconductor devices

[16p-502-1~10] Process technology for advanced power semiconductor devices

Thu. Mar 16, 2017 1:45 PM - 6:30 PM 502 (502)

Mutsuko Hatano(Titech), Masahiro Ishida(Panasonic), Katsuhiko Nishiwaki(Toyota)

4:30 PM - 5:00 PM

[16p-502-7] Ion Implantation into GaN and Its Application to Power Devices

Tohru Nakamura1,2, Tomoyoshi Mishima1, Kiyoji Ikeda1, Michitaka Yoshino1 (1.Hosei Univ, 2.Nagoya Univ)

Keywords:GaN, Ion implantation, MISFET

Ion implanted GaN MISFETs were fabricated on Mg doped epitaxial layer(1x1018 cm-3 ) grown on free-standing GaN substrate. Vth of 9 V was obtained for the device with a gate length of 2 μm. P-type conversion of n-GaN by Mg-ion implantation was performed using high quality GaN epitaxial layers grown on free-standing low-dislocation-density GaN substrates. P-n diodes fabricated by the Mg-ion implantation showed clear rectifying I-V characteristics.