Takashi Hishida

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Speaker, Author, Co-Author

Wed. Sep 19, 2018 9:00 AM - 12:00 PM 233 (233)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-233-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

11:45 AM - 12:00 PM

[19a-233-11] Inserting intermediate patterned metal layers for ３-５-on-Si multijunction solar cells with improved bonding interface properties

〇(M1)Takashi Hishida¹, Jianbo Liang¹, Naoteru Shigekawa¹ (1.Osaka City Univ.)