Harumi Iitsuka

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Speaker, Author, Co-Author

Fri. Sep 21, 2018 1:00 PM - 4:45 PM 233 (233)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[21p-233-1~14] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

3:45 PM - 4:00 PM

[21p-233-11] Characterization of CMP within wafer non-uniformity

〇Harumi Iitsuka^1,2, Takashi Yajima^3,2, Noriko Miura², Sommawan Khumpuang^2,3, Shiro Hara^2,3 (1.Yokogawa SS, 2.Minimal, 3.AIST)