Hiroyuki Tanaka

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Speaker, Author, Co-Author

Fri. Sep 21, 2018 1:00 PM - 4:45 PM 233 (233)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[21p-233-1~14] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

2:30 PM - 2:45 PM

[21p-233-7] Techniques to improve the grooved pattern through silicon via etching process with minimal ICP deep trench etcher

〇Hiroyuki Tanaka^1,2, Hisato Ogiso^1,2, Shizuka Nakano^1,2, Yoshiyuki Nozawa^2,3, Toshihiro Hayami^2,3, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL, 3.SPPT)

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