Yongxun Liu

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Speaker, Author, Co-Author

Fri. Sep 21, 2018 1:00 PM - 4:45 PM 233 (233)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[21p-233-1~14] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

3:15 PM - 3:30 PM

[21p-233-9] Development of CMOS-MEMS Co-Integrated Devices Using Minimal-Fab Process

〇Yongxun Liu¹, Hiroyuki Tanaka^1,2, Kazuhiro Koga², Sommawan Khumpuang^1,2, Masayoshi Nagao¹, Takashi Matsukawa¹, Shiro Hara^1,2 (1.AIST, 2.MINIMAL)