[18p-PB2-1~7] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [18p-PB2-4] A Study on Thick Au Proof-Mass for High-Performance MEMS Accelerometer

〇Tatsuya Koga¹, Daisuke Yamane¹, Toshifumi Konishi², Teruaki Safu², Shinichi Iida², Hiroyuki Ito¹, Noboru Ishihara¹, Katsuyuki Machida¹, Kazuya Masu¹ (1.Tokyo Tech, 2.NTT-AT)

Keywords:MEMS, Multi-layer metal technology, High sensitivity

We have developed the high sensitive MEMS accelerometer using multi-layer metal technology.
In order to realize the high performance MEMS accelerometer, we investigated the thickness of Au with proof mass for the wide detection range. This paper describes the experimental evaluation results from the proposed device.