The 79th JSAP Autumn Meeting, 2018

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Oral presentation

6 Thin Films and Surfaces » 6.2 Carbon-based thin films

[20p-222-1~23] 6.2 Carbon-based thin films

Thu. Sep 20, 2018 1:15 PM - 7:30 PM 222 (222)

Masami Aono(National Defence Academy), Toru Harigai(Toyohashi Univ. of Tech.), Tokuyuki Teraji(NIMS), Yukako Kato(AIST)

3:30 PM - 3:45 PM

[20p-222-10] A Study of Room-Temperature Bonding of SOI Wafer with Diamond-BOX Layer ２
- Evaluating electrical characteristics using test element group -

〇Yoshihiro Koga1, Kazunari Kurita1 (1.SUMCO CORPORATION)

Keywords:SOI wafer, diamond layer, room-temprature bonding

We have been studying a new SOI wafer with diamond-BOX layer to suppress self-heating of power devices. In this studying, we evaluated electrical characteristics using test element group on the studied SOI wafer.