2018年第79回応用物理学会秋季学術講演会

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4 JSAP-OSA Joint Symposia 2018 » 4.2 Photonics Devices, Photonic Integrated Circuit and Silicon Phonics

[21a-211B-1~9] 4.2 Photonics Devices, Photonic Integrated Circuit and Silicon Phonics

2018年9月21日(金) 09:00 〜 11:45 211B (211-2)

岩本 敏(東大)、Set Sze(東大)

11:00 〜 11:15

[21a-211B-7] Analysis of mode field diameter and macro bending loss of rectangular Trench-Assisted Fiber profile for Fiber-To-The-Home Technology

〇(PC)Vikram Palodiya1、Prakash Pareek2 (1.Sreenidhi Institute of Science and Technology, Hyderabad, India、2.Vaagdevi Engineering College (Vaagdevi Group of Colleges), Warangal, India)

キーワード:Bend Loss, MFD, Trench assisted fiber

In this paper, we have analyzed Rectangular Trench-Assisted Fiber [RTAF] for Mode Field Diameter [MFD] and low macro-bending loss. The modified profile of trench-assisted fibbers consists of central core and outer claddings. In between the cladding introducing deep trench filled by low RI materials. We analyze the effect of core, cladding and trench parameters on bending loss and MFD. We have theoretically studied the effect of different trench parameters on effective mode field diameter, and macro-bending loss of optical fiber. The analysis shows that the relative refractive index difference in trench affects the properties of mode field diameter and bending loss in optical fibbers for FTTH applications.