[21p-135-1~16] 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

[21p-135-15] On visualization of water flow of cutting part of dicing

〇(M2)Daisuke Ushijima¹, Kai Haruki¹, Kubota Hiroshi¹, Hashishin Takeshi¹, Yoshioka Masao¹ (1.Kumamoto Univ.)

Keywords:semiconductor, simulation

In a semiconductor manufacturing process, there is a process of cutting a wafer using a diamond blade called a dicing process. In the dicing step, water and cutting waste are scattered when the wafer is cut. The purpose of this research is to grasp the conditions for preventing contamination by simulation in order to prevent scattered cutting waste from being sucked into the exhaust duct and adhering to the wafer and contaminating the functional element part.