2018年第79回応用物理学会秋季学術講演会

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13 半導体 » 13.3 絶縁膜技術

[21p-145-1~14] 13.3 絶縁膜技術

2018年9月21日(金) 13:15 〜 17:00 145 (レセプションホール)

山本 圭介(九大)、堀田 育志(兵庫県立大)

14:45 〜 15:00

[21p-145-7] How Ge atoms behave in thermal oxidation of SiGe?

〇(P)Xiuyan Li1、Yusuke Noma1、Woojin Song1、Tomonori Nishimura1、Akira Toriumi1 (1.Univ. of Tokyo)

キーワード:SiGe oxidation

A slight and selective Si oxidation of SiGe, achieved by depositing and annealing a YSiOx film on it, has been proposed to improve dielectric/SiGe interface quality. How Ge behaves in this process remains unclarified, which is a key to further improvement of SiGe gate stacks. This work discusses this issue by paying attention to Ge movement at SiGe interface based on TEM, SIMS, Raman and TDS measurements.