The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

15 Crystal Engineering » 15.4 III-V-group nitride crystals

[21p-146-1~17] 15.4 III-V-group nitride crystals

Fri. Sep 21, 2018 1:30 PM - 6:00 PM 146 (Reception Hall)

Tsutomu Araki(Ritsumeikan Univ.), Narihito Okada(Yamaguchi Univ.)

3:45 PM - 4:00 PM

[21p-146-9] Surface Treatment Method of GaN Substrates for Homoepitaxial GaN Growth by REMOCVD

〇(P)Frank Wilson Amalraj1, Arun Kumar Dhasiyan1, Naohiro Shimizu1, Osamu Oda1, Hiroki Kondo1, Kenji Ishikawa1, Masaru Hori1 (1.Nagoya Univ.)

Keywords:III-V epitaxial growth

Our newly developed Radical Enhanced Metalorganic Chemical Vapor Deposition (REMOCVD) has a VHF (very high frequency-100MHz) plasma and proved that the growth temperature of Gallium Nitride (GaN) can be largely decreased without ammonia gas due to radical enhanced growth. GaN has excellent properties such as direct and wide band gap energy of 3.4 eV at room temperature in the hexagonal phase (Wurtzite). GaN therefore attracted much attention for their potential use in electronic devices. Major contaminants on GaN substrates are native oxides. Hence, the homoepitaxial growth of GaN on insufficiently cleaned or improperly prepared GaN substrates results in defective layers. In the present work, we focus on the surface preparation which is very essential for the growth of homoepitaxial GaN.