The 79th JSAP Autumn Meeting, 2018

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Poster presentation

15 Crystal Engineering » 15.6 Group IV Compound Semiconductors (SiC)

[21p-PB6-1~10] 15.6 Group IV Compound Semiconductors (SiC)

Fri. Sep 21, 2018 1:30 PM - 3:30 PM PB (Shirotori Hall)

1:30 PM - 3:30 PM

[21p-PB6-6] SOI-Si/4H-SiC pixel devices for radiation hardened image sensors

〇Tatsuya Meguro1, Hasebe Fumiaki1, Makino Takahiro2, Takeshi Ohshima2, Yasunori Tanaka3, Shin-Ichiro Kuroki1 (1.Hiroshima Univ., 2.QST, 3.AIST)

Keywords:SiC, bonding, image sensor