Liu Bai

Speaker, Author, Co-Author

Sun. Mar 18, 2018 1:15 PM - 5:30 PM B201 (53-201)

Oral presentation
| 3 Optics and Photonics
| 3.15 Silicon photonics

[18p-B201-1~14] 3.15 Silicon photonics

1:45 PM - 2:00 PM

△ [18p-B201-2] Non-destructive confirmation method of bonding situation for III-V/Si hybrid partial direct bonding

〇Liu Bai¹, Takehiko Kikuchi^1,3, Junichi Suzuki¹, Kumi Nagasaka¹, Nobuhiko Nishiyama^1,2, Hideki Yagi³, Tomohiro Amemiya^1,2, Shigehisa Arai^1,2 (1.Tokyo Tech., 2.FIRST, 3.SEI)

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