Kumi Nagasaka

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Speaker, Author, Co-Author

Mon. Mar 19, 2018 9:00 AM - 11:45 AM B203 (53-203)

Oral presentation
| 3 Optics and Photonics
| 3.13 Semiconductor optical devices

[19a-B203-1~9] 3.13 Semiconductor optical devices

9:30 AM - 9:45 AM

[19a-B203-3] Investigation of InP/Si bonding characteristics of Ar-FAB surface activated bonding for hybrid integration

〇Kumi Nagasaka¹, Junichi Suzuki¹, Takuya Mitarai¹, Yuning Wang¹, Tomohiro Amemiya^1,2, Nobuhiko Nishiyama^1,2, Shigehisa Arai^1,2 (1.Tokyo Tech, 2.FIRST)

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