[17a-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17a-C101-11] Improvement of transfer yield of single-crystalline silicon films by pillar shape control using ion implantation

〇Tomonori Yamashita¹, Ryutatsu Mizukami¹, Seiichiro Higashi¹ (1.Graduate School of Advanced Sciences of Matter, Hiroshima Univ.)

Keywords:flexible electronics, single-crystalline silicon