[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [17p-P7-5] Improvement of Bending Property of Micro-Cantilever Made of Gold by Controlled Electrodeposition

〇(M2)Keisuke Asano¹, Hao-Chun Tang¹, Chun-Yi Chen¹, Takashi Nagoshi², Tso-Fu Mark Chang¹, Daisuke Yamane¹, Toshifumi Konishi^1,3, Katsuyuki Machida¹, Kazuya Masu¹, Masato Sone¹ (1.Tokyo Tech, 2.AIST, 3.NTT-AT)

Keywords:Micro-Cantilever, Electrodeposited Gold, Hall-Petch Relationship