[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [17p-P7-6] Structure Stability of Au-Cu Alloy Micro-Cantilever Evaluated by Long-Term Vibration Test

〇Kyotaro Nitta¹, Koichiro Tachibana¹, Tang Haochun¹, Chen Chun-Yi¹, Mark Chang Tso-Fu¹, Daisuke Yamane¹, Toshifumi Konishi^1,2, Katsuyuki Machida¹, Kazuya Masu¹, Masato Sone¹ (1.Tokyo Tech., 2.NTT-AT)

Keywords:MEMS, Gold, Structure Stability