The 65h JSAP Spring Meeting, 2018

Presentation information

Poster presentation

13 Semiconductors » 13.5 Semiconductor devices and related technologies

[17p-P8-1~24] 13.5 Semiconductor devices and related technologies

Sat. Mar 17, 2018 1:30 PM - 3:30 PM P8 (P)

1:30 PM - 3:30 PM

[17p-P8-13] Effects of Current Density on Mechanical Properties of Electroplated Nickel with High Speed Sulfamate Bath

Takahiro Yamamoto1, Kengo Igawa1, Chen Chun-Yi1, Chang Tso-Fu Mark1, Takashi Nagoshi2, Osamu Kudo3, Ryu Maeda4 (1.Tokyo Tech., 2.AIST, 3.Alphaseiko, 4.Synapse)

Keywords:Sulfamic acid nickel plating, Current density, Micro Compression Test