The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

3 Optics and Photonics » 3.13 Semiconductor optical devices

[18a-B203-1~11] 3.13 Semiconductor optical devices

Sun. Mar 18, 2018 9:00 AM - 12:00 PM B203 (53-203)

Nobuhiko Nishiyama(Titech)

9:15 AM - 9:30 AM

[18a-B203-2] Thermal resistance analysis of VCSEL considering both thin-layer thermal conductivity reduction effect and analyzed heat distribution

Masaki Mimura1, 〇Tomoyuki Miyamoto1 (1.FIRST, Tokyo Tech)

Keywords:semiconductor laser, thermal resistance, optical wireless power transmission

For optical wireless power transmission, it is important to improve the efficiency and the output power density of a VCSEL. For improve the performance, high precision design of device thermal resistance is required. Although the device thermal resistance can be analyzed from the device shape and the thermal conductivity, the thermal conductivity of a thin layer is decreased to about 1/2 - 1/3 of the bulk value due to the phonon scattering.In this report, we discuss the numerical analysis results of the thermal resistance of VCSEL considering both the thin layer effect and the detailed heat generation region by current distribution analysis.