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[18p-A404-2] Titanium plate fabricated by sputter-less selective laser melting
Keywords:Selective laser melting, Titanium, Sputter
Selective laser melting (SLM), which is an additive manufacturing technology, is attractive due to its ability to freely form shapes. SLM can fabricate complicated shapes because it builds a 3D material layer-by-layer from a powder. However, some issues have yet to be resolved, including dimensional accuracy, surface finishes, processing time, and mechanical properties such as surface roughness, hardness, and crystal orientation. It is important to analyze the behavior of molten metal to resolve these issues.
In this study, dynamics of molten titanium irradiated with laser was investigated experimentally by a synchrotron radiation analysis. A contact angle with molten titanium was measured by synchrotron radiation at 30 keV while the laser irradiation. The size of Ti particle and laser spot diameter was same as 200 micro-meters. The Ti particle was place on the SUS304 substrate in a vacuum chamber. The chamber was evacuated at the pressure of 1 Pa. In this condition, the laser was vertically irradiated on the Ti particle. A baseplate temperature were varied from 25 to 500 degree Celsius. As the results, the baseplate temperature was increase with decrease the contact angle. At the baseplate temperature of 500 degree Celsius, the contact angle with molten Ti became small to 32 degrees.
Based on these facts, the melting and solidification process for SLM process were captured with high speed video camera, it was found that sputter was depended on the baseplate temperature. The sputter-less fabrication for SLM in vacuum was developed to minimize the surface roughness to 0.6µm at the laser scanning speed of 10mm/s.
In this study, dynamics of molten titanium irradiated with laser was investigated experimentally by a synchrotron radiation analysis. A contact angle with molten titanium was measured by synchrotron radiation at 30 keV while the laser irradiation. The size of Ti particle and laser spot diameter was same as 200 micro-meters. The Ti particle was place on the SUS304 substrate in a vacuum chamber. The chamber was evacuated at the pressure of 1 Pa. In this condition, the laser was vertically irradiated on the Ti particle. A baseplate temperature were varied from 25 to 500 degree Celsius. As the results, the baseplate temperature was increase with decrease the contact angle. At the baseplate temperature of 500 degree Celsius, the contact angle with molten Ti became small to 32 degrees.
Based on these facts, the melting and solidification process for SLM process were captured with high speed video camera, it was found that sputter was depended on the baseplate temperature. The sputter-less fabrication for SLM in vacuum was developed to minimize the surface roughness to 0.6µm at the laser scanning speed of 10mm/s.