The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-C101-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Mon. Mar 19, 2018 9:15 AM - 11:45 AM C101 (52-101)

Kuniyuki Kakushima(Titech)

10:15 AM - 10:30 AM

[19a-C101-5] Damageless Doping Technology for FinFETs by Spin-Coated PDS

Takashi Matsukawa1, Takahiro Mori1, Yoshihiro Sawada2, Yohei Kinoshita2, Yongxun Liu1, Meishoku Masahara1 (1.AIST, 2.Tokyo Ohka Kogyo)

Keywords:FinFET, doping, solid diffusion

Damageless doping process for FinFETs is demonstrated by solid diffusion utilizing cost-effective spin-coated phosphorus dopes silica (PDS). Damageless nature of the PDS diffusion doping is confirmed by TEM characterization of the doped fin. The PDS diffusion is successfully implemented in the extension doping of the FinFETs.